US to award SK Hynix up to $450 million for US chips packaging facility By Reuters
By David Shepardson WASHINGTON (Reuters) – The U.S. Commerce Department said on Tuesday it plans to award SK Hynix up to $450 million in grants to help fund an advanced packaging plant and research and development facility for artificial intelligence products in Indiana. In April, SK Hynix, the world’s second-largest memory chip maker, said it…